Ceramic Substrates And Packages For Electronic Applications

Htcc high temperature co fired ceramics alumina system and ltcc low temperature co fired ceramics glass ceramic system are available.

Ceramic substrates and packages for electronic applications.

Over 150 us companies produce or supply electronic ceramics. Substrates made from rubalit alumina ceramics. Rubalit 708 s with 96 al 2 o 3. Among the ceramics employed as electronic substrates and packages the dominant material is alumina aluminum oxide al.

At the same time the vacuum tight housings and substrates must. The insulating properties of ceramics are well known and these properties have found application in advanced ceramic materials for substrates and packages. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. This ceramic material is characterized by its extremely high strength and thermal conductivity.

Kyocera ecu substrates provide high density circuit design high temperature durability good heat dissipation and high reliability with multilayer ceramics. The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering. Printed resistors and high current capacity trough conductive line structures are also available.